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  • 型号: 637-20ABP
  • 制造商: Wakefield
  • 库位|库存: xxxx|xxxx
  • 要求:
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+xxxx $xxxx ¥xxxx

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637-20ABP产品简介:

ICGOO电子元器件商城为您提供637-20ABP由Wakefield设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供637-20ABP价格参考以及Wakefield637-20ABP封装/规格参数等产品信息。 你可以下载637-20ABP参考资料、Datasheet数据手册功能说明书, 资料中有637-20ABP详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

风扇,热管理

描述

HEATSINK TO-220 VERT MT BLK 2"散热片 TO-220 VERT MT 2"

产品分类

热敏 - 散热器

品牌

Wakefield-Vette

产品手册

产品图片

rohs

否含铅 / 不符合限制有害物质指令(RoHS)规范要求

产品系列

Wakefield 637-20ABP637

mouser_ship_limit

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数据手册

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产品型号

637-20ABP

不同强制气流时的热阻

4.7°C/W @ 200 LFM

不同温升时功率耗散

6W @ 55°C

产品

Heat Sinks

产品目录绘图

产品目录页面

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产品种类

散热片

其它名称

345-1030
63720ABP

冷却封装

TO-220

商标

Wakefield

安装风格

Through Hole

宽度

1.375"(34.93mm)

形状

矩形,鳍片

接合方法

螺栓固定和 PC 引脚

散热片材料

Aluminum

散热片样式

Folded

材料

材料镀层

黑色阳极化处理

标准包装

1

热阻

4.7 C/W

直径

-

离基底高度(鳍片高度)

0.500"(12.70mm)

类型

插件板级,垂直

自然条件下热阻

9.2°C/W

设计目的

TO-220

长度

2.000"(50.80mm)

颜色

Black

高度

50.8 mm

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PDF Datasheet 数据手册内容提取

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink TO-220 and TO-218 Standard Height Above Footprint P/N PC Board Dimensions Weight Plain Pin Without Pin in. (mm) in. (mm) lbs. (grams) 634-10ABP(cid:1) 634-10AB 1.000 (25.4) 0.640 (16.26) x 0.640 (16.26) 0.016 (7.48) 634-15ABP 634-15AB 1.500 (38.1) 0.640 (16.26) x 0.640 (16.26) 0.025 (11.21) 634-20ABP(cid:1) 634-20AB 2.000 (50.8) 0.640 (16.26) x 0.640 (16.26) 0.033 (14.95) Material: Aluminum, Black Anodized. These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti- solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications cally mounting TO-220 and TO-218 components. Models are available with or without wave- where quick assembly is needed and space is at a premium. MECHANICAL DIMENSIONS 634 SERIES TYPICAL THERMAL PERFORMANCE FOR 634-15ABP Notes: 1. Thermal compound is assumed between device and heat sink. 2.Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher. Dimensions: in. (mm) 637 SERIES High-Efficiency Heat Sinks For Vertical Board Mounting TO-220 Height Above Thermal Performance at Typical Load Standard PC Board “A” Maximum Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 637-10ABP(cid:1) 1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM 0.023 (10.43) 637-15ABP(cid:1) 1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 65°C @ 6w 5.5°C/W @ 200 LFM 0.035 (15.88) 637-20ABP(cid:1) 2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 55°C @ 6W 4.7°C/W @ 200 LFM 0.050 (22.68) 637-25ABP(cid:1) 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 48°C @ 6W 4.2°C/W @ 200 LFM 0.062 (28.12) Material: Aluminum, Black Anodized Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. and board space occupied must be minimized. Refer to the Accessory products section for Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight thermal interface materials, thermal compounds, and other accessories products. MECHANICAL DIMENSIONS 637 SERIES (EXTRUSION PROFILE 5183) NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 44 (cid:1)Normally stocked