10 9 8 7 6 5 4 3 2 1 注記NOTES 　1.使用材料 F F MATERIAL ハウジング：46ナイロン、ガラス充填、UL94V-0、白 HOUSING:PA46,GLASS FILLED,UL94V-0,WHITE アクチュエータ：ポリフェニレンサルファイド（PPS）、 ガラス充填、UL94V-0、黒 ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED,UL94V-0,BLACK ターミナル：リン青銅、ニッケル下地金めっき（t=0.2） TERMINAL:PHOSPHOR BRONZE,GOLD OVER NICKEL PLATING 0.5+0.1 0 金具：リン青銅、ニッケル下地錫めっき（t=0.2） 1 . FITTING NAIL: PHOSPHOR BRONZE,TIN OVER NICKEL PLATING 0 E 5± 　2.エンボステープ梱包時は、アクチュエータがロックした状態になります。 E . 0 IN THE PACKAGE,ACTUATOR OF PART E NO.52745-**59 SHOULD BE LOCKED. ソルダーテール半田付け面のズレ量、及び金具半田付け面のズレ量は、 3 基準面Hに対して上方向に0.1MAXIMUM、下方向0.15MAXIMUMとする。 MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM-H. UPPER DIRECTON:0.1MAXIMUM LOWER DIRECTION:0.15 MAXIMUM 偶数極に適用 4 APPLY FOR EVEN CIRCUIT. パターン剥離止め金具 5 FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN. D D 6 R0.3は、FPCの胴体部にかからないこと R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC. 7.ELV 及び RoHS 適合品 ELV AND RoHS COMPLIANT 16.1 14.3 10.65 9.5 52745-2097 20 15.6 13.8 10.15 9 52745-1997 19 15.1 13.3 9.65 8.5 52745-1897 18 14.6 12.8 9.15 8 52745-1797 17 14.1 12.3 8.65 7.5 52745-1697 16 C C 13.6 11.8 8.15 7 52745-1597 15 13.1 11.3 7.65 6.5 52745-1497 14 C 12.6 10.8 7.15 6 52745-1397 13 12.1 10.3 6.65 5.5 52745-1297 12 11.6 9.8 6.15 5 52745-1197 11 K 接点部(上面) 11.1 9.3 5.65 4.5 52745-1097 10 10.6 8.8 5.15 4 52745-0997 9 CONTACT POINT (UPPER SIDE) 10.1 8.3 4.65 3.5 52745-0897 8 9.6 7.8 4.15 3 52745-0797 7 5 金具 9.1 7.3 3.65 2.5 52745-0697 6 B FITTING NAIL 8.1 6.3 2.65 1.5 52745-0497 4 B 0.85 EMBOSSED PACKAGE 極数 D C B (A) ORDER No. オーダー番号 CKT. 8 CONNECTOR SERIES NO. : 52745-**59 2 . THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 1 DIMENSION UNITS SCALE CURRENT REV DESC: GENERAL TOLERANCES mm 10:1 (UNLESS SPECIFIED) GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ±　0.2 EC NO: 600082 0.5 FPC CONN. ZIF FOR ANGULAR TOL ± 3.0 ° DRWN: YCHEN128 2018/02/27 SMT R/A (UPPER CONTACT) GOLD PLATING 10 OVER 30 UNDER ±　0.25 4 PLACES ± 0.2 A 1.02 0.66 0.74 (金具V部IE投W影 K図) 3A0N G OUVLEARR 　　±　3　° ±　0.3 32 PPLLAACCEESS ±± 00.2.35 CAINPHITPKIR'AD:L: RKNETUAVKKIISTAIAOHANS:HI 22001188//0033//1144 DOCUMENT NUM PBERRODUCT CUSTOMER DDORC ATYWPEIDNOGC PARTREVISION A 2.455 (DETAIL OF FITTING NAIL) DRAFT WHERE APPLICABLE 1 PLACE ± DRWN: KTOJO 2005/02/23 SD-52745-050 PSD 001 D 0 PLACES ± APPR: NUKITA 2005/03/16 MUST REMAIN DRAFT WHERE APPLICABLE THIRD ANGLE PROJECTION DRAWING SERIES MATERIAL NUMBER CUSTOMER SHEET NUMBER DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:49 WITHIN DIMENSIONS WITMHUINS TD IRMEEMNASIINONS A3-SIZE 52745 SEE TABLE GENERAL MARKET 1 OF 2 FROERVIMSAIOTN: m: Has1ter-tb0-prod-A3 9 8 7 6 5 4 3 2 1 DATE: 2018/01/18

9 8 7 6 5 4 3 2 1 0.3±0.03 0.3±0.03 仕上がり厚さ 仕上がり厚さ THICKNESS THICKNESS 0.5(N+1)±0.07 E 0.5±0.1 0.5(N-1)±0.05 0.5±0.1 0.5(N+1)±0.07 E 0.5±0.05 0.5±0.08 0.5(N-1)±0.05 0.5±0.08 (PITCH) 0.35+0.04 -0.03 0.5±0.05 (PITCH) 0.3±0.03 R0.3 6 　 m)　m) D 40.5± 60.5± 補強板(STIFFENER BOARD) 40.5± 60.5± 補強板(STIFFENER BOARD) き：金めっき(0.２μm)　 　下地ニッケル(1-5μm)GOLD(0.2μm)　 　　　NICKEL UNDER(1-5μm) っき：金めっき(0.２μm)　下地ニッケル(1-5μG: GOLD(0.2μm)　 　　NICKEL UNDER(1-5μ D 適合金めっきFPC推奨寸法 適合金めっきFFC推奨寸法 っ G: め TIN め N A 　　　APPLICABLE FPC OF GOLD 　　　APPLICABLE FFC OF GOLD TI L A P PLATING RECOMMENDED DIMENSION PLATING RECOMMENDED DIMENSION L 仕上がり厚さ：0.3±0.03 仕上がり厚さ：0.3±0.03 P THICKNESS: 0.3+0.03/-0.03 THICKNESS: 0.3+0.03/-0.03 C パ半KPEAETタ田TPEINー禁RGN ン止 OAU0NおエTD.4 ASよリ5ROMELびアADA EORXFIN.G 3)0.6MAX. 3) 1.94MIN. L(0.3) 3(N.6O5N-AC(C0PUI.TM5CU±HL0)A.0T0I.V55E()N-1)±0.05 (0.3) 3).652.2 3.050.8 補強板：ポリイミドREINFORCE BOARD: POLYMIDE熱硬化接着剤THERMOSETTING ADHESIVE ベースフィルム：ポリイミド(25μm)BASE FILM: POLYIMIDE(25μm)熱硬化接着剤THERMOSETTING ADHESIVE導体部：　銅箔(35μm)COPPER FOIL (35μm)熱硬化接着剤THERMOSETTING ADHESIVE カバーレイ　:　ポリイミド(25μm)COVER FILM: POLYIMIDE(25μm) 補強板：ポリエステル系REINFORCE BOARD: PET 接着剤(難燃ポリエステル系)ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm)INSULATING FILM: PET(25μm) 接着剤(難燃ポリエステル系)ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 導体部：　銅箔(35μm)COPPER FOIL (35μm) 接着剤(難燃ポリエステル系)ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm)INSULATING FILM: PET(25μm) C 金具パターンエリア 0. 0. .2 SOLDERING AREA M ( ( コネクタ位置 1.25 (0 FPC構成推奨仕様 FFC構成推奨仕様 B OF FITTING NAIL CONNECTOR 1.25 1.1 STRUCTURE OF FPC STRUCTURE OF FFC B DETAIL L POSITION 参考基板レイアウト (マウント面) RECOMMENDED P.C.BOARD PATTERN DIMENSION(REF.) (MOUNTING SIDE) PATTERN THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION R0.303 DIMENSION UNITS SCALE CURRENT REV DESC: BOARD GENERAL TOLERANCES mm 5:1 (0.605) (UNLESS SPECIFIED) GENERAL TOLERANCES (FROM PATTERN EDGE) (UNLESS SPECIFIED) A 10 UNDER ±　--- EC NO: 600082 0.5 FPC CONN. ZIF FOR A ANGULAR TOL ± 3.0 ° DRWN: YCHEN128 2018/02/27 SMT R/A (UPPER CONTACT) GOLD PLATING VIEW M 10 OVER 30 UNDER ±　--- 4 PLACES ± 0.2 CHK'D: KTAKAHASHI 2018/03/14 30 OVER ±　--- 3 PLACES ± 0.25 (DETAIL OF FITTING NAIL APPR: NUKITA 2018/03/14 PRODUCT CUSTOMER DRAWING ON PATTERN) ANGULAR 　　±　---　° 2 PLACES ± 0.3 INITIAL REVISION: DOCUMENT NUMBER DOC TYPEDOC PARTREVISION 1 PLACE ± DRWN: KTOJO 2005/02/23 DRAFT WHERE APPLICABLE SD-52745-050 PSD 001 D 0 PLACES ± APPR: NUKITA 2005/03/16 MUST REMAIN DRAFT WHERE APPLICABLE THIRD ANGLE PROJECTION DRAWING SERIES MATERIAL NUMBER CUSTOMER SHEET NUMBER DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:49 WITHIN DIMENSIONS WITMHUINS TD IRMEEMNASIINONS A3-SIZE 52745 SEE TABLE GENERAL MARKET 2 OF 2 FROERVIMSAIOTN: m: Haster-tb-prod-A3 9 8 7 6 5 4 3 2 1 DATE: 2018/01/18

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